BOM / Component Risk Checker
Find out which parts on your BOM are a risk before you build.
Upload your BOM and tell us your operating conditions. Cadlete’s electronics and PCB design engineers check every component against its datasheet and known PCB manufacturing DFM failure modes, solder bridging, solder gap, thermal derating, footprint mismatch, and flag what needs a second look with a simple green, orange, red rating, backed by a decade of embedded electronics and PCB design experience shipping consumer, IoT, and industrial products.
The checker cross-references each line item’s part number against its datasheet for rated operating temperature, voltage, and tolerance versus the conditions you specify, then flags footprint and second-level assembly risks (solder bridge, solder gap, tombstoning, insufficient copper thickness for your layer stack-up). Every red or orange flag is reviewed by a Cadlete PCB design engineer before it reaches you, not just returned as a raw automated scan.
How it works
Questions About BOM / Component Risk Checker
What specific PCB failure modes does this actually check for, beyond a datasheet lookup?
Beyond rated operating temperature, voltage, and tolerance, the checker flags footprint and second-level assembly risks like solder bridging, solder gap, tombstoning, and insufficient copper thickness for your layer stack-up, the real DFM failure modes that show up at assembly, not just on paper.
What does a red, orange, or green rating actually mean?
Green means the part checks out against your stated operating conditions and known assembly risks. Orange and red flag a real concern, reviewed by a Cadlete PCB design engineer before it reaches you, not a raw automated score with no explanation.
Do I need a finished BOM, or can I check a work-in-progress component list?
A work-in-progress list works fine, an Excel or CSV BOM is the best-supported format, and a KiCad project or ZIP also works, so you can catch a risky part choice before the design is finalized rather than after.