High-Power GaN Dual Half-Bridge PCB: 6-Layer Design for 20A Switching

GaN Power Board: High Switching Power on a 6-Layer PCB

Gallium nitride (GaN) technology enables faster, more efficient power switching than traditional silicon, but designing with it demands careful engineering. Our client needed a high-power board built around state-of-the-art GaN technology.

CADLETE Designs developed a complex GaN dual half-bridge PCB system capable of delivering very high switching power at the output, over 12V and 20A. To handle this complexity, the board was realized with a 6-layer PCB stack-up.

Alongside the power stage, we integrated multiple peripheral components, including ADCs for voltage, current and temperature measurements. We also added peripheral connectors and additional debugging channels for the high-complexity processor on board.

The result is an advanced power electronics platform that combines high output, precise measurement and developer-friendly access in one board.